On November 14, SBS Toshiba Logistics presented a case study of using structural analysis in packaging design as part of their digital transformation (DX) efforts at "3DEXPERIENCE WORLD JAPAN 2025," hosted by Dassault Systèmes.
<Scenes from the case presentation>
"3DEXPERIENCE WORLD JAPAN 2025" was the largest 3D CAD event in Japan under the "SOLIDWORKS" brand. Held under the theme "One Step Beyond - Take a Step Towards a Connected Future," it provided a space to experience manufacturing where design, production, and improvement are interconnected, and value is repeatedly created.
At the event's user case study presentation, Taichi Toda, in charge of packaging and jig technology, spoke about a DX case study titled "Analysis of Drop Impact on Cardboard Packaging - Going Beyond Logistics."
<Mr. Toda giving a speech>
In his presentation, Mr. Toda discussed corrugated cardboard, which has recently attracted attention as an eco-friendly packaging material in response to environmental concerns and the move away from plastics, and presented examples of how structural analysis can be used in packaging design. He explained that commercially available CAE (computer-aided engineering) does not have sufficient material property data (material strength values) for corrugated cardboard, so the company conducted material tests on corrugated cardboard using its own testing facilities to create material property data that can be used with CAE. By tackling the challenge of analyzing the drop impact of corrugated cardboard as a packaging material to protect products, they were able to create value-added solutions for their customers.
SBS Toshiba Logistics exhibited a booth at the event as a presenting company, showcasing various services such as DFL (Design for Logistics) packaging design, ISO 17025 certified packaging testing, and packaged cargo impact simulation.
